简介:
雷登云,副教授、硕士生导师。主要从事数字集成电路设计、集成电路安全性分析、集成电路可靠性测试、车规功能安全与信息安全等研究。
研究方向:
1.数字集成电路设计;
2.软硬件协同加速器设计;
3.电路可靠性与安全性;
4.车规功能安全与信息安全。
教育经历:
2006/09-2010/07,西安电子科技大学,集成电路设计与集成系统,获学士学位
2010/09-2015/07,北京大学,微电子学与固体电子学,获博士学位
工作经历:
2022/07-至今,广东工业大学,集成电路学院,副教授
2015/07-2022/06,工业和信息化部电子第五研究所,高级工程师
科研项目:
1.基于阻变存储器的逻辑锁定关键技术研究,国家自然科学基金,2023.1-2025.12
2.处理器片上安全防护传感器设计技术研究,中国计算机协会-飞腾基金,2022.11-2023.11
3.芯片可信任架构的研究与设计,总装预研基金,2017.7-2019.6
4.数字电路潜在故障评估技术研究,总装预研基金,2016.6-2018.6
科研成果:
1. Duan, Xiaoxing, Jian Zou, Bin Li*, Zhaohui Wu, and Dengyun Lei*. "An Online Monitoring Scheme of Output Capacitor's Equivalent Series Resistance for Buck Converters Without Current Sensors." IEEE Transactions on Industrial Electronics 68, no. 10 (2021): 10107-10117.
2. Wang, Yiming, Qiang Huo, Xiaoxin Xu, Fei Tan, Rui Gao, Qing Luo, Yiming Yang, Qirui Ren, Xiaojin Zhao, Xinghua Wang*, Dengyun Lei*, Feng Zhang*. "A Homogeneous, Reconfigurable, and Efficient Implementation of PUF in 3-D Selector-Free RRAM." IEEE Transactions on Electron Devices 68, no. 5 (2021): 2577-2581.
3. Huo, Qiang, Renjun Song, Dengyun Lei*, Qing Luo, Zhenhua Wu, Zuheng Wu, Xiaojin Zhao, Feng Zhang*, Ling Li, and Ming Liu. "Demonstration of 3D convolution kernel function based on 8-layer 3D vertical resistive random access memory." IEEE Electron Device Letters 41, no. 3 (2020): 497-500.
4. Gao, Rui, Dengyun Lei*, Zhiyuan He, Yiqiang Chen, Yun Huang, Yunfei En, Xiaoxin Xu, and Feng Zhang*. "Effect of Moisture Stress on the Resistance of HfO2/TaOx-Based 8-Layer 3D Vertical Resistive Random Access Memory." IEEE Electron Device Letters 41, no. 1 (2019): 38-41.
5. Gao, Rui, Dengyun Lei*, Zhiyuan He, Yunfei En, and Yun Huang. "Layer-dependent resistance variability assessment on 2048 8-layer 3D vertical RRAMs." Electronics Letters 55, no. 17 (2019): 955-957.